| 摘要 |
<p>A heat-curable resinous composition comprises (1) at least one polycarboxylic acid component selected from: (A) carboxyl group containing resins having 2 or more carboxyl groups in the molecule and having a number average molecular weight of from 1,000 to 30,000 and (B) polycarboxylic acids having 2 or more carboxyl groups in the molecule and having a number average molecular weight of less that 1,000; and (2) at least one polyepoxy component selected from: (C) epoxy resinins having 2 or more epoxy groups in the molecule and having a number average molecular weight of from 1,000 to 30,000; and (D) polyepoxy compounds having 2 or more epoxy groups in the molecule and having a number average molecular weight of less than 1,000, with the Proviso that the combination of (B) and (D) is excluded; and further containing a monoalkyl stannate as a hardening catalyst.</p> |
