| 摘要 |
A multilayer thick film package for housing a microchip is formed from a series of insulating wafers. A wafer adapted to occupy an outer position on the package has a first series of apertures positioned to correspond with the placement of pins on the package, and wafers adapted to occupy inner positions on the package each have a second series of apertures. The second series of apertures is comprised of apertures that correspond in position to the first series of apertures, but is also comprised of additional apertures. Conductive material in the additional apertures allows electrical connection to be made within the package to the conductive lines that extend from the pins of the package to the inner package interface adapted to abut to a microchip. Two forms of the electrical connections are discussed. One form related to connection of some of the conductive lines on a wafer to an electrically conductive coating at ground potential on one of the other wafers, this form being used in frequency sensitive applications. Another form relates to connection of some of the conductive lines on a wafer to a parallel line or lines on another wafer for reducing the resistance in the line in power sensitive applications. Packages capable of housing a variety of microchips may be formed from wafers each having only a first or a second series of apertures, thus reducing hard tooling cost.
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