| 摘要 |
<p>PURPOSE:To check a resistance value at a semiconductor chip unit and to remove a detective product at a water stage in its early stage without executing an assembly operation and without evaluating a characteristic by a method wherein a new pad for measurement use is not installed and a checking circuit for a resistance value is built in a semiconductor chip. CONSTITUTION:A semiconductor device is constituted as follows: bonding pads 2-1 to 2-4 are formed on a semiconductor chip 1; a checking circuit 3, for a resistance value, where two kinds of resistances R1, R2 for checking use have been formed between the bonding pads 2-2, 2-3 is contained. The resistance R1 is a buried resistance of 400OMEGA and the resistance R2 is a diffused resistance of 40KOMEGA a maximum potential terminal for internal cell use and a maximum potential terminal for output transistor use are used for the bonding pads 2-2, 2-3. When the semiconductor chip 1 is measured, an identical voltage is applied to the bonding pads 2-2, 2-3 and the checking circuit 3 is not influenced. When the resistance value is checked, a potential difference is impressed between the bonding pads 2-2, 2-3 and the resistance is measured.</p> |
