| 摘要 |
<p>PURPOSE:To obtain a package, for high power consumption use, where a heat sink for heat-dissipation use can be assembled at its inside by a method wherein a frame where a semiconductor integrated circuit chip has been mounted and a frame for heat-sink use are resin-sealed and molded in a state that they are overlapped partially. CONSTITUTION:The following are provided: a frame 3 where a semiconductor integrated circuit chip 2 has been mounted, a frame 17, for heat-sink use, playing a role to dissipate heat of the integrated circuit chip 2. The frame 3 and the frame 17 for heat-sink use are resin-sealed and molded 15 in a state that they are overlapped partially. For example, a frame part of a lead frame where a semiconductor integrated circuit chip 2 has been mounted and a frame part 18 of a lead frame 16 for heat-sink use are formed to be of an identical size. Then, a positioning pin installed at a lower metal mold of a molding metal mold is inserted into a hole 19 for positioning use of the lead frame ]6 for heat-sink use and into a hole for positioning use of the lead frame; a positioning operation is executed. After that, a sealing resin 15 is injected into a cavity of the molding lower metal mold; a semiconductor device whose outer package has been treated is obtained.</p> |
