| 摘要 |
PURPOSE:To enable formation of a fine-wired conductive metal layer of mass- producibility with good yield by attaching a conductive metal layer in a desired wiring circuit pattern all over a metal foil, by bonding the conducting metal layer and an insulating board with adhesive, and by thereafter dissolving and eliminating the entire of the metal foil chemically. CONSTITUTION:Adhesive 9 is applied all over a conductive metal layer 8 of a metal foil 5. A layer of the adhesive 9 is heated to semi-cured state, that is, B stage, a surface of the adhesive 9 is laminated on an insulating board 10, and a layer of the adhesive 9 is really curred applying contact bonding therebetween by a heat roller, etc. Then, a plating resisting resist layer 7 which is applied all over the metal foil 5 and can be striped is thereafter removed and the metal foil 5 which consists of the exposed copper foil is dissolved and eliminated chemically by the use of corrosion solution. Thereby, a printed wiring board is manufactured wherein a conductive metal layer 8 of wiring circuit pattern is constituted in a plane with a layer of the adhesive 9. Thereby, the conductive metal layer 8 of a wiring circuit type of high concentration can be constituted in a plane on the insulating substrate 10 and a printed wiring board of a good mass-producibility can be acquired in this way. |
