| 摘要 |
PURPOSE:To prevent cream solder which is applied at a first line form drying and setting by unloading a printed board first from a multistage rack on a loader of the first line and by also unloading said printed board first at a loader of the next line. CONSTITUTION:When unloading of a printed board 2 which is loaded on each stage of a multistage rack 1 on a loader L1 of a first line is started at an uppermost stage, loading to a vacant multistage rack 5 on an unloader UL1 is started also at the uppermost stage. Then, the multistage rack 5 on the unloader UL1 of a full first line is transferred onto a loader L2 of a second line; unloading is started at the uppermost stage and loading to a vacant multistage rack 6 on the unloader UL2 is carried out after processing is finished. If packing process does not exist after the second line, loading to the multistage rack 6 on the unloader UL2 of the second lien can be started at any stage. In the meantime, when unloading at the loader L1 of the first line is started at a lowermost stage, loading to the unloader UL1 is also started at the lowermost stage, and unloading at the loader L2 of the second line is also started at the lowermost stage. |
