| 摘要 |
<p>PURPOSE:To obtain a semiconductor device with less deformation such as warpage and improved mechanical strength by incorporating a plate material with a sharp protrusion at the tip on the front and rear surfaces. CONSTITUTION:After wiring a thin metal wire 14 to a semiconductor element 12 fixed to a specified position of a lead frame 13 consisting of metal and the tip part of an internal lead of the lead frame 13, a plate material 16 with a sharp protrusion 15 at the tip is incorporate on the front and rear surfaces in a resin-sealed semiconductor device obtained by sealing formation by a resin 17. For example, the semiconductor 12 is adhered and fixed to a specified position of the die pad 13 of lead frame by using means such as Au-Si eutectic or Ag base bond and then is wire-connected by the use of the wire 14. After that, it is subjected to sealing formation by a sealing resin 17 along with the plate material 16 with a protruding part 15 on the front and rear surfaces and is completed by forming an outer lead 18 of lead frame by press machining, etc.</p> |
