发明名称 MANUFACTURE OF CIRCUIT BOARD
摘要 PURPOSE:To manufacture a circuit board in a simple method and improve it in quality by a method wherein photosetting resin liquid thin layers, which ar used for the formation of an insulator and a conductor respectively, are irradiated with ultraviolet rays in required patterns to form an insulating pattern and a conductor pattern, and these layers are laminated. CONSTITUTION:A board 22 is horizontally immersed into a photosetting resin liquid 21 to form a thin film 21s of the liquid 21 on the board 22, and the film 21s is selectively irradiated with ultraviolet rays by an ultraviolet laser 23 to enable a required part of the film 21s to set for the formation of a hardened resin layer 24. Moreover, the board 22 is slightly immersed to form the layer 24 through the same process as above. The resin liquids 21 to form an insulator and a conductor respectively are provided, and the layers 24 are formed using these liquids alternately through a process as mentioned above, whereby a circuit board of stable quality, which is composed of an insulating board part and a circuit conductor part formed in one piece, can be easily manufactured.
申请公布号 JPH02132881(A) 申请公布日期 1990.05.22
申请号 JP19880285773 申请日期 1988.11.14
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 KOBAYASHI KENZO
分类号 H05K3/00;H05K3/46 主分类号 H05K3/00
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