发明名称 CRYSTALLINE SUBSTRATE POLISHING APPARATUS
摘要 PURPOSE:To automatically remove a regulating load by providing a first load having an oblique groove at its top and a gap at its lower part, and a second load engaged with the interior of the first load having a protrusion coincident with the groove and attached with a crystalline substrate to be polished at its lower part. CONSTITUTION:When a crystalline substrate 12 is thick, a protrusion 2 coincides with a groove 1, both a first load 5 and a second load 6 are applied to the substrate, which can be roughly polished rapidly for a short period of time. As the substrate 12 is thinned, the protrusion 2 moves down in the groove 1 formed obliquely in a circular state while rotating, and when it arrives at a gap 3, the regulating load 5 does not coincide with the load 6, only the load 6 is applied to the substrate 12, which is polished whole holding the polishing state desirably until the bottom 20 of the load 6 is arrived at the bottom 4 of the load 5. When the substrate is thinned, a load 8 is moved down on an oblique face 9, a returning force of the load 8 is applied by a spring 7, a force for pushing the substrate is reduced, the substrate can be polished whole holding the polishing state desirably, and the finishing if ended in thickness when the recoiling force of the spring 7 is balanced with the force of the load 8.
申请公布号 JPH02125428(A) 申请公布日期 1990.05.14
申请号 JP19880278696 申请日期 1988.11.04
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ABE TOMOKO;YOKOZUKA TATSUO;NEGISHI HIDEHIKO;IMAMURA HIROKO
分类号 B24B1/00;B24B37/013;H01L21/304 主分类号 B24B1/00
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