| 摘要 |
PURPOSE:To decrease the manufacturing cost by sealing a laser diode element carried by a substrate and a part of a externally connecting conductor with a light-transmitting resin. CONSTITUTION:A lead frame in which a number of substrates 2 and leads 9, 10 as required for several semiconductor laser devices are formed integrally is prepared. A submount 3 to which a laser diode element 5 is bonded to a widened section 2 of each substrate 1 and then wires are bonded to the element. Each device is sealed with a light-transmitting resin 14 by means of compression molding, potting or the like. The lead frame is then cut off to separate the individual semiconductor laser devices. In this manner, it is possible to obviate the need of stems, bases, caps, transparent plates, leads and so on and to decrease the material cost. Accordingly, the manufacturing cost of the semiconductor laser devices can be lowered. |
