发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the disconnection from an internal circuit as far as a metal wire does hot come off even if aluminum of a bonding part is corroded by arranging a polycrystalline silicon layer under an aluminum bonding pad. CONSTITUTION:A polycrystalline silicon layer 7 is arranged under a bonding pad 2 and the connection part between the bonding pad 2 and a wiring 3. The aluminum wiring 3 liable to be corroded by water content is completely protected with an insulating film 4, and not exposed. Thereby, if the aluminum around the metal wiring and the bonding part is corroded, the electric disconnection state from an internal circuit is not caused as far as the metal wire does not come off, so that the reliability is improved.
申请公布号 JPH02125632(A) 申请公布日期 1990.05.14
申请号 JP19880279838 申请日期 1988.11.04
申请人 NEC CORP 发明人 NAKAMURA KIYOSHI
分类号 H01L21/60 主分类号 H01L21/60
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