| 摘要 |
PURPOSE:To manufacture a finely perforated wiring board having fine holes of high roundness by a method wherein a first and a second conductor layers having a great number of first fine holes are formed on a first and a second carrier substrates, a second fine hole having a diameter larger than a diameter of the first fine hole is formed on an insulating substrate, and the insulating substrate is stuck to the conductor layer by making the first fine hole correspond to the second fine hole. CONSTITUTION:A metal sheet of, for instance, aluminium or the like is taken as a carrier substrate 7, and a fine hole 9 of a size of diameter B and a conductor layer 81 or 82 are formed by photofabrication. A half hardened film-like adhesive layer 11 is laminated on an insulating substrate 10, and perforation is performed to the insulating substrate 10 and an adhesive complex, i.e. an insulating layer 12. When a hole diameter of the conductor layers 81, 82 are taken as B and a minimum conductor width around the fine hole 9 is taken as C, a hole diameter D of a fine hole 13 provided to the insulating layer 12 exists in a relation of B<=D<=C. Alignment is performed by an optical method by using an alignment mark, and respective fine holes of the conductor layers 81, 82 and the insulating substrate 10 are made to correspond to each other. Tentative bonding is performed and pressure heating is performed. Etching removal of the carrier substrate 7 is performed to manufacture a finely perforated wiring board.
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