| 摘要 |
<p>PURPOSE:To enhance massproductivity and to enhance reliability by forming front and rear oversheets, two layers or more of core material therebetween, providing a mold release resin between the layers of the core material, and burying to secure an IC module in a recess cut until arriving at the resin by cutting means. CONSTITUTION:Oversheet materials 1a, 1b of front and rear layers and core materials 2a, 2b, 2c are provided as three layers, silicone resin 13 is interposed as mold release resin to be held on the whole periphery of the edge of a recess to be formed between the layers of the materials 2b and 2c as a noncoupling layer. The resin 13 is formed by printing on the material 2b, and adhesive strength to the material 2c is substantially not provided. In order to form a recess on a card base material, a linear groove 14 is formed along the edge of the recess by an end mill as cutting means. Its depth may, for example, be arrived at the noncoupling layer or the material 2c. Then, the noncoupling part 15 formed from the result of the formation of the groove 14 is mechanically removed, and a recess 16 is formed. Further, an IC module 17 is buried fixedly with an adhesive 18 in the bottom of the recess 16.</p> |
