| 摘要 |
PURPOSE:To eliminate density irregularity during printing due to the response of a thermister to a row of thermal resistors and the shape of a fabricated heat radiation plate by mounting a chip thermister directly on the rear of a surface where the row of resistors is formed on a thermal substrate. CONSTITUTION:On one of the surfaces of a ceramic substrate 7, drive signal terminal patterns 4-3, 4-3', 4-3''..., a recording power supply terminal pattern 4-2 and a thermister terminal pattern are formed. On the other surface, a wiring pattern for thermister 2 is formed, and the wiring pattern for thermister 2 and the terminal patterns for thermister 4-1, 4-1' communicate with each other through a viahole 3. A resistor film and a communication film are formed, and electrode wiring patterns 6-1, 6-1' and the row of resistors 5 are patterned to form an abrasion-resistant layer on the row of resistors. Then an IC pellet 8 is mounted and this pellet and the electrode wiring pattern 6-1 are connected with gold wire 9. A chip thermister 1 is soldered 10 to the wiring pattern for thermister 2 on the other surface, and a thermal substrate is mounted on a heat radiation plate 20 with an escape hole for thermister 21. |
