| 摘要 |
PURPOSE:To improve detection accuracy by inspecting the disconnection of a wire on the side of a pad by passing microcurrent through the wire just before the wire is connected to a terminal on the side of a lead frame. CONSTITUTION:After a wire 5 is connected to a pad 3 on a semiconductor chip 2, and just before the same is connected to a terminal 4 on the side of a lead frame 1, microcurrent is passed through the wire 5 to detect any disconnection of the wire 5 from the pad 3. That is, once such microcurrent is passed through the semiconductor chip 2 via the wire 5 just before the wire 5 is bonded to the terminal 4 on the side of the lead frame 1, voltage of the wire 5 is raised provided there is existent any wire disconnection. Hereby, wire disconnection can securely be detected. |
