| 摘要 |
PURPOSE:To make it possible to determine reliably and quantitatively whether a bonded section is connected satisfactorily or not directly after the bonding by visually recognizing the state of temperature distribution in the bonded section through an infrared filter. CONSTITUTION:Current is supplied through a capillary 5 to a bonded section of a circuit component 6 directly after a finish of the bonding, whereby an image of temperature distribution based on resistance values according to whether the bonded section is bonded satisfactorily or not is visually recognized through an infrared filter of a visual sensor 8. Thus, the condition of the bonded section can be determined quantitatively by comparing said image with a reference image. |
