| 摘要 |
<p>TREATMENT OF COPPER CLAD THERMOPLASTIC LAMINATES USING CONCENTRATE SULFURIC ACID Copper clad thermoplastic laminates having holes drilled therein may be treated to render the hole walls thereof adherently electrolessly platable by immersing the laminate in concentrated sulfuric acid, optionally containing an oxidizing agent, and then removing sulfuric acid from the laminate thus treated. As oxidizing agent, ammonium persulfate is preferred. S P E C I F I C A T I O N</p> |
