| 摘要 |
<p>PURPOSE:To prevent generation of protrusions on a cut surface of an element without taking the element after separation to pieces, by a method wherein dicing/cutting of a semiconductor board obtained by sticking an adhesive tape to the rear where a groove is formed are performed so that a blade does not come into contact with the adhesive tape. CONSTITUTION:An n type gallium phosphide arsenide and epitaxial layers 2 are laminated on an n<+> type gallium arsenide board 1 whose facial direction is 100. A groove 3 is formed in succession by etching the surface of an n<+> type gallium arsenide side of the board. p-n joining is formed on the epitaxial layer 2 in succession and light emitting, diodes 4001-4128 are formed. Then after formation of an ohmic electrode on a p-side, the ohmic electrode on an n-side is formed. Then the n-side of the board is stuck to an adhesive tape 5 and the board is diced with a thin blade 6 of a resin material. In this instance, a distance is set up between an end of the blade 6 and the adhesive tape 5. Dicing/cutting of a separating and cutting allowance part in the direction running parallel with an arrangement direction of the luminescence diode are performed with the blade.</p> |
