| 摘要 |
<p>PURPOSE:To prevent the deformation of inner leads due to the contraction of a tape by providing a shape having expanding and contracting property for the tape which is stuck to the inner leads of a semiconductor device. CONSTITUTION:A semiconductor element 1 is bonded to a fixing part 3. The electrodes of the semiconductor element 1 are connected to inner leads 4 through thin metal wires 2. A tape 5a is stuck to the inner leads 4. Slits are provided in the tape 5a so as to provide expanding and contracting property. The contraction of the tape due to thermal history can be absorbed. In this way, the deformation of the inner leads 4 due to the contraction of the tape can be prevented. When the surface of a tape 5b is made to be a zigzag planar shape, the expanding and contracting property is provided, and the deformation of the inner leads 4 can be also prevented.</p> |
