| 摘要 |
PURPOSE:To enable the effective, direct monitoring of integrated circuit temperatures, in particular, the temperatures of integrated circuit ready to be packaged or molded, by a method wherein a temperature monitoring circuit consisting only of one or more diodes is installed on a common substrate. CONSTITUTION:In an integrated circuit wherein one or more circuits 11-14 consisting of passive and active elements are installed on a common substrate 1, at least one temperature monitoring circuit 30 consisting only of one or more diodes 31-33 is installed on the common substrate 1. For example, in the vicinity of a circuit 14 consuming much power in a monolithic integrated circuit, three diodes 31-33 are arranged. The three diodes 31-33 are connected in series for the constitution of a temperature monitoring circuit 30, which is in turn connected to a wiring pad 29 positioned in the vicinity of a chip 1. A constant voltage is supplied to the temperature monitoring circuit 30 consisting of said diodes 31-33, whereby the temperature of that part may be monitored by monitoring the current. |
