| 摘要 |
PURPOSE:To improve the adhesion of a conductor circuit layer by forming the conductor circuit layer 4 onto a required enameled substrate and dielectric thin-layers just under the layer 4 or just under and near the layer 4. CONSTITUTION:A conductor circuit layer is shaped onto an enameled substrate, in which a metallic core is coated with crystallized glass, and conductor thin- layers just under the layer or just under and near the layer. Accordingly, an excellent thick-film circuit forming enameled substrate, the adhesion of which with the conductor circuit layer is increased, is prepared easily. |
