| 摘要 |
<p>PURPOSE:To obtain the title ultraviolet-curing composition excellent in heat resistance, humidity resistance, solvent resistance and electrical insulating properties by mixing an epoxy poly(meth)acrylate with unsaturated compounds and, optionally, a photopolymerization initiator. CONSTITUTION:The title composition is obtained by mixing an epoxy poly(meth) acrylate having at least two (meth)acryloyl groups in the molecule, obtained by reacting an epoxy resin with (meth)acrylic acid (e.g., an epoxy polyacrylate prepared by using a phenol novolack epoxy resin), with an unsaturated compound (B) of the formula (wherein R1 and R2 are each H or CH3; R3 is CH3 or C2H5; a, b, c and d are each 0-5, and the average of the sum of a+b+c+d is 0-20), another unsaturated compound (e.g., phosphate of 2-hydroxyethyl methacrylate) and a photopolymerization initiator. This composition is excellent in heat resistance, humidity resistance, solvent resistance and electrical insulating properties and is suitable for a permanent protective film of a printed wiring board.</p> |
