| 摘要 |
<p>PURPOSE: To simply remove a chip from a tape such as wafer processing tape, by evacuating at least a part of the tape lower face to pull a tape part off from the chip, and heating the tape to more reduce the adhesive strength. CONSTITUTION: A wafer 10 is diced to form many circuit chips 11 which are then adhered to a tape 12 supported with a film frame 14. The frame 14 is laid on a vacuum plate 16 and channels formed in this plate are evacuated through a vacuum pipe to provide a vacuum on the top surface of the plate 16. The top surface has grid-like cross grooves 20, and the grooves are evacuated to pull the tape 12 into the grooves 20, resulting in release of the tape from the chips 11. Thus, the chips 11 can be removed from the tape 12, using a vacuum pensile 28, etc. The tape 12 is heated typically at 50-60 deg.C to more easily remove.</p> |
