| 摘要 |
<p>PURPOSE:To shorten the connecting lead length and to improve the heat radiating feature by a method wherein an end of a conductor pattern is caused to protrude from the outer circumference of a through-hole so that the end will connect to a semiconductor chip electrode inserted into said through-hole and that the other end of the conductor pattern will serve as a connecting terminal for the outer circumference. CONSTITUTION:A metal piece 2, same in form as a semiconductor chip 5 to be inserted into a through hole 1a in a mounting substrate 1, is inserted, and a resist 3 is applied to the inserted metal piece 2, which resist 3 as applied includes the circumference 1a-1 of the through-hole 1a. Next, a conductive paste 1b-1 for the formation of a conductive pattern 1b is applied, dried, heated, and baked, and then the metal piece 2 is removed, which process provides the mounting substrate 1 with a conductor pattern 1b formed thereon. For the installation of the mounting substrate 1 on a radiating plate 4, a semiconductor chip 5 with a solder bump 5a-1 formed on an electrode 5a is fixed to the radiating plate 4, the semiconductor chip 5 is inserted into the through- hole 1a, the conductor pattern 1b in alignment with the electrode 5a is bonded to the radiating plate 4, and the bump 5a-1 and the conductor pattern 1b are caused by contact bonding to connect to each other.</p> |
