| 摘要 |
PURPOSE:To prevent electrode bodies and a fine lead wire, which should be in a non-connection state, from coming into contact to each other by a method wherein second fine lead wires having a wire length shorter than that of the first fine lead wire connect electrically the electrode bodies and a supporting plate and at the same time, support the sagged first fine lead wire. CONSTITUTION:Fine lead wires 10b and 10c are connected with a fine lead wire 10a in such a way as to cross the wire 10a at the lower part of the wire 10a. The wires 10b and 10c are wiring leads to connect electrodes on a monolithic IC chip 8 with a supporting plate 1 and at the same time, are used as fine lead wires for support use to prevent the wire 10a from sagging significantly. The wires 10b and 10c are equal in length, but are shorter than the wire 10a, the wires 10b and 10c cross the wire 10a at their respective first bonding sides and the wire 10a lies over the cross part of the wire 10b and the wire 10c. The electrode bodies on the IC chip formed with first bonding parts of the wires 10a-10c are used as electrode bodies of a mutually equal potential. |
