| 摘要 |
<p>PURPOSE:To reduce the damage to a chip and to reduce an irregularity in the timing of a separation by a method wherein a pushing-up rod arranged and installed in the central part of a stage strips an electronic component from an adhesive stage, the electronic component is pushed up by means of a pushing-up needle and the electronic component is sucked by means of a collet. CONSTITUTION:A chip 1 is pasted on an adhesive tape 2. A pushing rod 11 whose tip is flat is installed in the center of a stage 10 arranged at the lower part; it is surrounded by four pushing-up pins 12. When the tip of a collet 3 is lowered to a position which is a little higher than the chip 1, the collet is stopped momentarily; while the pushing-up rod 11 pushes up the chip 1 via the tape 2 from the lower part and strips the chip 1 from the tape 2, the chip 1 is sucked by a chip-holding part 8. During this process, since the surface of the pushing-up rod 11 is flat, the chip 1 is not tilted. The chip is sucked by a vacuum hole 4 in the collet 3. During this process, the pushing-up pins 14 break the tape 2 from the lower part, are raised, push up the chip 1 slightly and separate the tape 2.</p> |
