| 摘要 |
<p>PURPOSE:To improve moisture resistance reliability by providing a resin chip mount, and forming a package structure in which tab hanging leads are eliminated. CONSTITUTION:A lead frame in which parts of inner leads 1a are molded of a chip mount 2 is removed from a metal mold, a semiconductor chip 3 is positioned on the mount 2, and secured by adhering through an adhesive. Then, the electrodes of the chip are wire bonded to the leads by gold wirings 4 or the like, and a resin sealed body 5 is formed by pouring resin. Thus, the chip is supported only by the mount of the resin, tab and tab hanging leads are not presented, and hence water content is not invaded through the leads thereby to improve moisture resistance reliability.</p> |
