| 摘要 |
PURPOSE:To obtain the subject material having heat-resistance, sufficiently durable to drilling owing to excellent interfacial adhesivity and useful as a material for printed circuit board, etc., by treating a raised aromatic polyamide fiber with an amino polyamide and adding the fiber to a heat-resistant resin. CONSTITUTION:The objective composite material is produced by treating a raised aromatic polyamide fiber [preferably poly(p-phenylene terephthalamide)] with an amino polyamide produced by the polycondensation of an unsaturated fatty acid dimer and a polyamide and adding the treated polyamide fiber to a heat-resistant resin (preferably polyamide or epoxy resin). |
