| 摘要 |
<p>PURPOSE:To prevent an adhesive for mounting from flowing out to an external terminal by a method wherein at the time of mounting an IC module in a recessed part of a card base, a masking film for hermetically sealing a through- hole is preliminarily adhered to the external terminal, and after the IC module is mounted, the film is released. CONSTITUTION:A masking film 30 for hermetically sealing a through-hole 14 is preliminarily adhered to an external terminal 13 of an IC module 11. Therefore, at the time of mounting the IC module 11 in a recessed part 25 of a card base 20, an adhesive 24 entering the through-hole 14 is prevented by the film 30 from flowing out to the exterior. Thus, the adhesive 24 will not flow out to the side of the external terminal 13, so that the appearance of the IC card 10 is prevented from being spoiled, and failure in contact at the external terminal 13 is obviated.</p> |
