| 摘要 |
<p>PURPOSE: To cut a long silicon dendrite web into small pieces automatically by providing a table for supporting the web, a workstation for cutting the web and scoring, and a mechanism for moving the web toward the workstation. CONSTITUTION: A machine has a first workstation 50 for scoring a dendrite web 10 and demarcating small web pieces with a specific length. Then, a second workstation 56 scores the small, demarcated web pieces, determines a 90 deg. corner for next treatment, and at the same time separates the small web pieces with a specific length from a dendrite web 10. Furthermore, mechanism 28 and 30 for moving the dendrite web toward the first and second workstations by a specific length are provided. Therefore, the small pieces are scored in addition to the cutting of the dendrite web to a specific length, so that a next treatment is enabled, thus cutting a long silicon dendrite web into short, small pieces automatically.</p> |
