| 摘要 |
PURPOSE:To enable a circuit pattern to be printed making no slip at all even if any distortion is caused in a work by repeated exposure by a method wherein, when the distortion is caused in the work, auxiliary chucks are driven to deform the work for correcting the distortion caused in the work. CONSTITUTION:When any slip in pattern at four corners of a wafer 2 and a mask 32 is detected, the atmospheric pressure is applied to four peripheral suction parts 13 of a main chuck 7 while the central part and the peripheral four corners of the wafer 2 are suction-held by the central suction part 12 and the four auxiliary suction parts 26 of auxiliary chucks 8. Then, the voltage in the level corresponding to the slip level detected by an alignment device is supplied for a y piezo element 24 and an x piezo element 25 of respective auxiliary chucks 8. At this time, the suction bodies 22 of respective auxiliary chucks 8 are driven in X-Y direction on a base 10a to deform the wafer 2 into the state relieving the distortion caused in the wafer 2. Through these procedures, any defective printing can be prevented from occurring. |
