发明名称 MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve heat dissipation efficiency in both sides by providing a projected blade for cooling purpose in the circumference of quartz reaction furnace in the vicinity of both ends to be used for the processings such as oxidation, diffusion, CVD and epitaxy of semiconductor. CONSTITUTION:The metal flanges 9, 9' are in the double structured and are provided with the cooling water paths 10, 10' and are wound by water cooling pipes 11, 11' for the cooling purpose. The quartz tube ends 12, 12' which are joined through the O rings 8, 8' are provided with many blade shaped heat dissipating plates 13, 13' at its circumference in such a structure as the air cooling type radiator having enlarged heat radiating area. The O rings 8, 8' are less changed in quality by heat and the packing condition by the rings 8, 8' is also improved, resulting in more improved sealing efficiency. Accordingly, entrance of air or leakage of reaction gas into reaction furnace can also be reduced.
申请公布号 JPS58141523(A) 申请公布日期 1983.08.22
申请号 JP19820022689 申请日期 1982.02.17
申请人 TOKYO SHIBAURA DENKI KK 发明人 HASHIMOTO MASANORI;SUZUKI SHINICHI
分类号 C23C16/46;H01L21/205;H01L21/22;H01L21/31 主分类号 C23C16/46
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