| 摘要 |
<p>PURPOSE:To contrive the miniaturization and the thinning of the title housing required for electronic components by a method wherein a terminal part of the structure, in which a terminal fixing film and the film of a flexible substrate are partially welded, is provided and the flexible substrate and a housing made of synthetic resin are constituted in one body. CONSTITUTION:A resin-molded housing 1 has an external shape in which metal terminal pieces 2-1 to 2-5 constituting a terminal part are protruding from the side part of the housing 1, and a substrate 3 is inserted into the housing 1. On the substrate 3, a current collecting pattern 3-1 is formed on the upper surface of a resin film by etching, and an insulator pattern 3-2 is formed on the prescribed part thereon. A terminal part, having the structure wherein the film of the substrate 3 is partially welded, is provided, the substrate 3 is inserted into the housing made of synthetic resin in such a manner that a conductive pattern is exposed in the housing, and the flexible substrate and the synthetic resin housing are integrally formed. As a result, the miniaturization and thinning of the housing can be accomplished.</p> |
