| 摘要 |
PURPOSE:To reduce the cost and the size through a relatively simple structure, by jointing a substrate and a top board through a flow path board in which a plurality of pressure chambers communicated with respective orifices, an ink flow path and a common liquid chamber are etched by means of high temperature compression, and bonding the top board to a plurality of electromechanical converters through adhesive. CONSTITUTION:A substrate 11 is jointed firmly with a top board 13, by means of high temperature compression, through a flow path board 12 in which a plurality of orifice sections 16 for forming small ink delivery holes, a plurality of pressure chambers 17 communicated with respective orifice sections and transmitting pressure wave thereto, a plurality of ink flow path sections 18 communicated with the pressure chamber sections 17, and a common liquid chamber section 21 are etched. Preferably, they are made of same material such as stainless steel. A plurality of electromechanical converters 14 are constructed with piezoelectric elements and the like and secured, in place, in respective grooves 22 in the top board 13 through such as epoxy adhesive. |
