| 摘要 |
An aluminium heatsink (15) for semiconducting devices (16) includes at least one portion, and preferably two portions (21), formed so as to be solderable into a circuit board. The portions are coated with aluminium solder (22) which, may itself, not melt during the securing process, but allows the portions to be soldered using conventional tin/lead solder. In an alternative embodiment, portions extending from said heatsink have a tine (29) which is secured by a hole in the circuit board. |
