摘要 |
<p>PURPOSE:To perform appropriate selection of material, design, and manufacture for respective components by providing a micro-gap in a film by mean of current supply heating, and providing an electron emitting member in this micro-gap separately. CONSTITUTION:A film 3 in a specified shape consisting of metal or semiconductor is provided over a base board 4, and electrodes 1, 2 made of conductive metal are fixed to the two ends. A micro-gap 5 due to crack is formed in the middle of this film 3 by the interelectrode current supply process. When an organic solvent with fine particles dispersed is coated by rotation method, the fine particles are located in the micro-gap 5 as an electron emitting member 6. With the obtained element in a vacuum vessel a voltage is applied between the electrodes 1, 2, and a high voltage is applied to the upper part of the element by a pullout electrode, not illustrated, and now electrons are emitted from the micro-gap 5. A base board having a step may also be used, wherein this step works as electron emitting part. According to this constitution the film material shall be 0.01-2mum being selected from a variety of materials with such factors taken into consideration as the amount of electric power at the current supply process, the amount of local heat emission, coefficient of thermal expansion, and heat resistance, while the material for electron emitting member may be selected also from many materials having low work function and heat resistance.</p> |