| 发明名称 |
Integrated circuit package using plastic encapsulant. |
| 摘要 |
An integrated circuit package uses an encapsulant frame (7) which prevents the encapsulant (9) used to seal the integrated circuit chip (3) from the ambient atmosphere from flowing to unwanted areas and to permit the encapsulant to be deposited with a controllable depth. |
| 申请公布号 |
EP0338728(A2) |
申请公布日期 |
1989.10.25 |
| 申请号 |
EP19890303680 |
申请日期 |
1989.04.13 |
| 申请人 |
AMERICAN TELEPHONE AND TELEGRAPH COMPANY |
发明人 |
COHN, CHARLES |
| 分类号 |
H01L23/28;H01L23/057;H01L23/24 |
主分类号 |
H01L23/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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