| 摘要 |
PURPOSE:To improve the heat-resisting property against a solder and the sticking property, etc., of the title composition by constituting the composition of a linear polymer compd. having an ethylenically unsatd. group and a carboxylic group in the side chain of the polymer, a photopolymerizable monomer having two or more of ethylenically unsatd. groups in the end group of the monomer, an epoxy resin having two or more of epoxy groups in a molecule, a photosensitizer and a laminated mineral contg. a thermosetting agent between layers. CONSTITUTION:The linear polymer compd. having the ethylenically unsatd. group and the carboxyl group in the side chain is incorporated in a curable composition in a preferable amount of 10-90wt.%, and the photopolymerizable monomer having at least two ethylenically unsatd. group in the end group is incorporated in the curable composition. The epoxy resin having at least two epoxy groups in the molecule is preferably incorporated in the composition in an amount of 1-90wt.%, and the photosensitizer and the laminated mineral contg. the thermosetting agent between the layers are incorporated in the composition as an essential component. Thus, a permanent protective film with the excellent heat-resisting property against the solder, and sticking property, etc., can be formed. |
