ELECTRICAL COMPONENTS

摘要

1. Substrates carrying electronic circuits were connected to one another by bonding in the past. The invention is intended to make possible a mechanical connection without a bonding agent. …2. To this end, the substrates are provided with projections (4) or cut-outs (5) on their surface, lower side or side surfaces, so that the substrates (1) and (6) can be plugged onto or into one another. Electrical connections can also be produced via the projections (4) and cut-outs (5), if the same are designed to be electrically conductive. …3. The invention also allows substrates of different materials to be joined together, for example for heat dissipation purposes.