| 摘要 |
PURPOSE:To prevent the variability of a load at the time of wire bonding and to contrive the improvement of the reliability of the wire bonding by a method wherein the difference of altitude between an input metallized electrode on the surface of a transistor chip and a metallized electrode on an insulator substrate, which is one end of an external input matching circuit, is eliminated and both metallized electrodes are wire-bonded together. CONSTITUTION:A metallic piece 7 having a good electric conductivity is provided on an input line electrode layer 6 on an insulator substrate 1. An input metallized electrode on the surface of a transistor chip 4 and the piece 7 fixed on the layer 6 are wire bonded together by a fine metal wire 5 on the side of input. In Such a way, as the heights of parts, to which the wire 5 is wire bonded, of the metallized electrode and the piece 7 become an equal height, the variability of a load at the time of wire bonding is dissolved and the reliability regarding wire bonding is improved.
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