| 摘要 |
<p>PURPOSE:To prevent the generation of cracks of a package due to thermal shock, by fixing a frame composed of organic material like polyimide along the terminal periphery of a die pad of the lead frame, by using polymer adhesive agent which is heat resisting and low hygroscopic. CONSTITUTION:In a lead frame, a frame 4 is fixed on the end-portion of a die pad 3 of the lead frame 1 made of iron-nickel alloy or copper alloy, by using organic adhesive agent 5 like polyimide. The frame 4 is composed of polyimide system resin which is heat resisting, low hygroscopic, and of low elasticity. In the lead frame 1, gold or silver plating 8 is formed on the die pad 3 and the surface side of the tip parts of inner leads 7. On the die pad 3 of the lead frame 1, a semiconductor chip 9 is stuck by using silver paste 10 wherein silver powder is mixed in epoxy system resin or polyimide system resin. The silver paste 10 is hardened at 100-260 deg.C for 4-5 hours to fix the semiconductor chip 9 on the die pad 3. Then the the semiconductor chip 9 and the plating part 8 of the inner lead 7 are connected with thin wires 12 of gold or copper, and resin molding is performed by resin seal metal mold.</p> |
