| 摘要 |
<p>PURPOSE:To stop the moisture creeping along the boundary between a resin seal package and a lead by forming a protruding part and a recessed part at the lead part situated inside the package. CONSTITUTION:In an IC having a resin seal type miniature square package, protruding parts 10a and recessed parts 10b are arranged alternately in the inner direction and outer direction at each lead 9 inside the package 14 and are formed collectively. When the protruding parts 10a and the recessed parts 10b are formed in the halfway part of the lead, a creeping route of the moisture from the outside of the package 14 to a wire and a pellet becomes long; accordingly, it is possible to prevent that the moisture which has crept reaches the wire and the pellet.</p> |
