| 摘要 |
Apparatus for treating the surfaces of a plurality of wafers, such as semiconductor wafers, which comprises a container of treatment fluid having an open upper side for accepting a cassette containing a plurality of vertically disposed wafers. The cassette is supported in the fluid in said container and a transducer carrier is mounted in the lower portion of the container. The carrier has at least one megasonic transducer arranged to project a beam of ultrasonic energy upwardly over the vertical surfaces of the wafers. The transducer carrier is moved parallel with the wafer surfaces transversely of the container whereby the ultrasonic energy beam contacts and treats the entire surface of all of the wafers therein.
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