| 摘要 |
<p>PURPOSE:To manufacture a circuit board through simple processes and to keep the adhering part of the terminals from being exposed out of the circuit board, by cooling rapidly hot melted resin or a resin formation in a state of being heated together with setting it for a specified time. CONSTITUTION:Together with making conductor layers 3, 3' on the surfaces of plates 5, 5', electrode terminals 4, 4' adhere to the conductor layers 3, 3'. Then, hot melted resin is poured into a metal mold 6 with the plates 5, 5' fixed in the metal mold 6, and the plates 5, 5' are removed by rapidly cooling the resin formation 2 which has set for a specified time. This enables the electrode terminals 4, 4' and the conductor layers 3, 3' to be connected in the resin formation 2. Therefore, disconnection accidents of the electrode terminals 4, 4' can be prevented, and besides a circuit board can be manufactured through the simple and quick processes.</p> |
