| 摘要 |
PURPOSE:To prevent high density polyethylene molded objects from being deformed or fused due to melting by clustering the high density polyethylene molded objects around at least one heat transfer pipe. CONSTITUTION:The device is installed within the thermal medium circuit, and the thermal medium comprising a fluid such as ethlene glycol flows not only in a heat transfer pipe 1 but also through the space between high density polyethylene molded objects 2 to directly and indirectly exchange heat with the high density polyethylene molded objects 2. In order for the high density polyethylene molded objects 2 to be resistant to flow even if they are melted, shape-stabilized, high density polyethylene molded objects are suitably used in which the bridge connection is established between polyethylene molecular chains to form a mesh-like high polymer. For the heat transfer pipe 1, metallic pipes of good thermally conductive material such copper or meshed or porous pipes which allow the thermal medium to flow both inside and outside the pipe are preferably used. |
