Semiconductor component

摘要

A semiconductor component with an IC chip has a power supply lead (5) and a ground lead (6) which are both, with the exception of the outer ends of the leads, subdivided into at least two sections (5d, 5e and 6d, 6e) via one or more longitudinal slits (5c, 6c). The inner end of one section (5d or 6d) of the power supply lead (5) or of the ground lead (6) is respectively electrically connected only to output (final) stage transistors of a data in/output circuit in the IC chip (1), and the inner ends of the further sections (5e or 6e) of the power supply lead (5) or of the ground lead (6) are electrically connected to further circuits in the IC chip (1). The presence of the longitudinal slits (5c, 6c) in the leads reduces the effect on the remaining circuits of power supply noise produced in the output stage transistors during the laser operations.