| 摘要 |
PURPOSE:To improve flatness by uniformly feeding a polishing liquid onto the whole undersurface of a wafer in the inside part of a carrier plate and uniformly polishing the undersurface by installing a plurality of polishing liquid feeding holes for feeding the polishing liquid onto the polishing surface of a surface plate, onto the carrier plate. CONSTITUTION:A wafer 5 fixed on the undersurface of a carrier plate 6 is pressed onto the polishing surface 1a of a surface plate 1. In this state, the surface plate 1 is revolved in the direction of arrow around the axis line O, and a polishing liquid is supplied onto the polishing surface 1a, providing a relative movement between the polishing surface 1a of the surface plate 1 and the surface of the wafer 5, and the undersurface (obverse surface) of the wafer 5 is polishing-worked. In this case, the polishing liquid is supplied onto the polishing surface 1a from four polishing liquid feeding holes 7 drilled on the carrier plate 6, and the polishing liquid supplied onto the polishing surface 1a is uniformly supplied on the whole undersurface of the wafer 5 in the inside part of the carrier plate 6, accompanied with the revolution of the carrier plate 6, and the undersurface of the wafer 5 is uniformly polishing-worked with a desired flatness. |
