| 摘要 |
An IC package extracting mechanism used in an IC socket is disclosed. The socket has a socket substrate including an IC package accommodation section, and a contact for a contacting a terminal of the IC package which is accommodated in the IC package accommodating section. The socket includes a seesaw lever for pushing up the IC package. The seesaw lever has at its one end an IC package push-up lever portion disposed below the IC package accommodated in the IC package accommodation section and at its other end a push-down lever position. The IC package push-up lever portion and the push-down lever portion are able to move up and down in a seesaw motion balancing on a support disposed at the center between the portions. The socket substrate is provided with push-down means for applying push-down force to the push-down lever portion. The push-down means pushes down the push-down lever portion to move the IC package push-up lever portion up, so that the IC package will be pushed up.
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