| 摘要 |
<p>PURPOSE:To prevent heat from generating by jumping leads from the face of a conductor pattern by the elasticity of the leads when solder is melted thereby to electrically and mechanically isolate it, thereby interrupting power supply to an integrated circuit. CONSTITUTION:The leads of an integrated circuit package are disposed at positions designated by leading lines 2', and electrically and mechanically connected by solders 5 to conductor pattern 3 formed on a printed substrate material 4. If the integrated circuit is abnormally heated due to a cause from one direction and the solders 5 are melted, the leads are deformed to the positions of the lines 2' by the elasticity of the leads 2. Thus, electric connections between the leads 2 and the pattern 3 is interrupted. when this phenomenon occurs at power source pins, the power supply to the integrated circuit is interrupted, and it is obvious to prevent heat from generating.</p> |
