| 摘要 |
<p>The invention uses a procedure in which the following operations are carried out: 1) positioning the chip (3) on that area of the supporting unit (2) where soldering is to take place; 2) placing a small amount of solder (13) near the chip; 3) raising the temperature of elements (2), (3) and (13) to the point at which the solder will melt. When the soldering alloy becomes a liquid, it "wets" the edges of the chip and, thanks to the principle of capillarity, wetting is then extended to the entire surface area of contact between the chip and the supporting element (figure 4).</p> |
